Jiangsu Changdian Technology Co., Ltd., founded in 1972, is a well-known trademark and listed company in Jiangsu Province, focusing on semiconductor packaging and testing business, providing customers with a full set of solutions such as chip testing, packaging design, packaging and testing

Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full set of solutions such as chip testing, packaging design, packaging and testing. The company was successfully listed on the main board of Shanghai in 2003, becoming the first listed company in semiconductor packaging and testing in China, and now has a national enterprise technology center, a postdoctoral research station, and is a national key high-tech enterprise, a high-density integrated circuit national engineering laboratory relying unit and the chairman unit of the integrated circuit packaging technology innovation strategic alliance.

On the basis of the large-scale production of traditional IC packaging, the company is committed to the research and development of high-end packaging technology, and has taken the lead in realizing the large-scale production of WL-CSP, SiP, copper pillar bump, Flip-Chip and other technologies in China, among which 25um ultra-thin chip manufacturing process technology, 25um ultra-thin chip stacking process technology, high-density gold/copper wire bonding technology, micro-miniature integrated system substrate process technology (MIS), and high-density copper pillar bump process technology have reached the international advanced level. With a number of independent intellectual property rights, the company will continue to seek greater breakthroughs in the field of high-density, system integration, and micro-volume packaging technology in the future.

The company has passed the system certification of ISO9001, QS9000, ISO14001, TSI6949, QCO80000 and SONY green partner. The "Changjiang" brand has won the titles of "China Semiconductor Famous Brand" and "Jiangsu Famous Brand".

The company was successfully listed on the A board of the Shanghai Stock Exchange in June 2003 (stock code 600584).

The company has three subordinate enterprises: Jiangyin Changdian Advanced Packaging Co., Ltd., Jiangyin Xinshun Microelectronics Co., Ltd., and Jiangyin Xinji Electronic Equipment Co., Ltd

Jiangyin Changdian Advanced Packaging Co., Ltd. was established in August 2003, mainly engaged in the development, manufacturing and sales of semiconductor bumping and its packaging products (TCP, COF, COG, FCQFN, FCBGA, WLCSP, WBBGA, Stacked Die Packaging). The company has a number of domestic and foreign invention patents with independent intellectual property rights and patented technology, and is committed to the development of IC high-end packaging technology, and maintains a leading edge in technology with strong competitiveness.

Jiangyin Xinshun Microelectronics Co., Ltd. specializes in the research and development, production, sales and application services of semiconductor discrete device chips. The developed products include epitaxial planar small power tube series, power tubes, thyristors, color TV tubes, voltage regulator diodes, Schottky diodes, varactor diodes, switching diodes and other transistor chips, and the product quality is at the leading level in China.

Jiangyin Xinji Electronic Equipment Co., Ltd. specializes in R&D and manufacturing of semiconductor packaging, testing and testing, precision molds, tools and precision machining, and has a scientific and technological team composed of senior talents integrating R&D and manufacturing.

Company vision: to build a world-class semiconductor packaging and testing well-known enterprise.