Shenzhen Xingsen Express Circuit Technology Co., Ltd., a famous trademark in Guangdong Province, a listed company, is a high-tech enterprise integrating PCB business, one-stop service, integrated circuit business and military business
Xingsen Technology is committed to providing the best and fastest service for the continuous innovation of electronic technology, and becoming a world-class hardware outsourcing design service provider. Founded in 1999, Xingsen Technology is a listed company on the Shenzhen Stock Exchange, headquartered in Shenzhen, China, and has established production and operation bases in Guangzhou, Yixing, Jiangsu and the United Kingdom. The company has set up branches in Beijing, Shanghai, Wuhan, Chengdu and Xi'an, and subsidiaries in Hong Kong and the United States, and has established dozens of customer service centers at home and abroad, forming a global marketing and technical service network, providing high-quality services to more than 4,000 customers around the world.
Xingsen Technology's future goal is to establish the world's largest rapid manufacturing platform in the field of PCB prototypes and multi-variety small batches; Provide rapid proofing, mass production and manufacturing services for advanced IC substrate products and supporting technical services for the IC industry chain; It will also build an open technical service platform, build a team of senior technical consultants and experts in the industry, form a comprehensive solution capability for general core technologies in the field of electronic hardware design, and provide customers with personalized one-stop service in combination with supporting multi-variety rapid placement service capabilities.
In terms of PCB manufacturing business, Xingsen Technology has always maintained the world's leading multi-variety delivery (more than 230,000 varieties in 2014) and fast delivery (the average delivery time of model express is less than 7 days), combined with high-level flexible management, diversified comprehensive technical capabilities, large-scale costs and the company's continuous construction of multi-field core technologies and other leading advantages, to further consolidate and enhance the company's leading position in the field of PCB industry model and small batch.
On the basis of the PCB manufacturing business platform, Xingsen Technology actively promotes the one-stop service model of "PCB design-manufacturing-SMT placement", with the goal of "creating the best overall value for the project", eliminating the inconvenience of multi-party communication, follow-up and coordination in product design, supporting processing and production procurement process management. Through the seamless connection of various business modules within the company, it effectively shortens the cycle of customer R&D, pilot test and production, reduces the overall cost, and improves the success rate of customer R&D projects through professional technical services. In the field of PCB design, in the face of the challenges of high-speed signal and RF microwave and other product hardware research and development technology development, the company's technological innovation has always kept pace with the world, in addition to providing professional PCB Layout outsourcing design services, it can also provide design and simulation services including SI, PI, EMC, RF, Thermal, Mechanical, etc., to provide comprehensive R&D solutions from design, testing, debugging to verification for customers in communications, network servers, security, storage and other industries; At the same time, the company's SMT placement business is positioned in a multi-variety rapid delivery mode, providing full-process services from component purchase, PCBA placement and welding, online testing, complete machine testing, etc., effectively supporting customers to shorten the overall project cycle.
In 2013, Xingsen Technology officially entered the integrated circuit industry chain, which will be an important area for the company's strategic development in the future. The company's "high-density packaging flip chip substrate products and industrialization project" was successfully declared as a major national science and technology project, and was supported by the national 02 special fund, achieving leapfrog development. Based on the IC substrate business, Xingsen Technology will actively build the advantages of large-scale multi-variety rapid delivery and advanced technology, and is committed to becoming a local leader in this field, and building an integrated solution capability from carrier board design, manufacturing to packaging and testing solution provision, and providing various high-quality and efficient supporting services for the IC industry chain.
As an excellent local national enterprise, Xingsen Technology has been committed to contributing to China's national defense. In 2010, the company built a high-level independent military PCB manufacturing plant, combined with the strength of our PCB design field, has been for aerospace, aviation, electronic technology, weapons industry, shipbuilding heavy industry and other hundreds of military units to provide one-stop service of product design and development and equipment manufacturing. The company has won the recognition and trust of military customers by virtue of its excellent R&D and manufacturing capabilities, fully customized and flexible management advantages, perfect quality system guarantee and confidentiality system control. Xingsen Technology will continue to make progress on the basis of the industry's leading technology and management platform, adhere to the quality as the center, take "zero defect" as the goal, strengthen the control of the GJB-9001B military product production process system, and ensure that the product quality fully meets the requirements of high reliability of weapons and equipment; At the same time, Xingsen Technology adheres to the development concept of continuous innovation, focuses on the research and development of process technology, closely supports the forward-looking development and production needs of weapons and equipment technology, and moves forward quickly in the direction of gradually becoming an overall solution service provider for military modular products and system-level products.
To provide customers with more valuable technical services and overall solutions is the direction of Xingsen Technology; Further international development is the goal of Xingsen Technology's efforts. Looking forward to the future, Xingsen Technology will continue to focus on the innovation and development of electronic hardware, and make persistent efforts in the fields of PCB business, one-stop service, integrated circuit business and military business, so as to provide customers with first-class services and create more value.
